Ultra-thin Body Buried In_0.35Ga_0.65As Channel MOSFETs with Extremely Low Off-current on Si Substrates

In this paper, we investigated the electrical properties of the Metal-oxide-semiconductor gate stack of Ti/Al₂O₃/InP under different annealing conditions. A minimum interface trap density of 3×10¹¹cm^-2eV^-1 is obtained without postmetallization annealing treatment. Additionally, utilizing Ti/Al₂O₃/InP MOS gate stack, we fabricated ultra-thin body buried In_0.35Ga_0.65As channel MOSFETs on Si substrates with optimized on/off trade-off. The 200nm gate length device with extremely low off-current of 0.6nA/µm, and on-off ratio of 3.3×10⁵, is demonstrated by employing buried low indium (In_0.35Ga_0.65As) channel with InP barrier/spacer device structure, giving strong potential for future highperformance and low-power applications.